Message-ID: <19473234.1075845218851.JavaMail.evans@thyme> Date: Mon, 4 Jun 2001 09:37:01 -0700 (PDT) From: alerts@alerts.equityalert.com To: alewis@ect.enron.com Subject: Your News Alert for BRCM Mime-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Transfer-Encoding: quoted-printable X-From: "Equity Alert Center" @ENRON X-To: Andrew Lewis X-cc: X-bcc: X-Folder: \Lewis, Andrew H.\Lewis, Andrew H.\Deleted Items X-Origin: LEWIS-A X-FileName: Lewis, Andrew H..pst [IMAGE]=09[IMAGE]=09[IMAGE]=09 Market Watch [IMAGE] Largest Short Postition Decreases [IMAGE] La= rgest Short Postition Increases [IMAGE] Lock-up Expiry Dates [IMAGE] = IPO Quiet Periods Expiries [IMAGE] IPO Withdrawals [IMAGE] Analyst = EPS Change - Upside [IMAGE] Analyst EPS Change - Downside [IMAGE] Hig= hest Analyst Activity [IMAGE] Earnings Calendar - This Week [IMAGE]= Upcoming Splits [IMAGE] Stock Splits [IMAGE] Coverage Initiation = [IMAGE] Coverage Re-Iteration HelpDesk [IMAGE] Unsubscribe [IMA= GE] Update my Membership / Profile [IMAGE] Forgot Username / Password = [IMAGE]Add / Edit Alerts [IMAGE]View My Alerts [IMAGE] = =09 As requested, your News Alert for BRCM follows from EquityAlert.com. = Broadcom Introduces High-Performance Single-Chip All-CMOS Bluetooth Radi= o MONTE CARLO, Monaco, Jun 4, 2001 (BUSINESS WIRE) -- Bluetooth Congress = 2001 Blutonium(TM) Chip Combines Radio and Baseband Functions on = Monolithic High-Performance Single-Chip Transceiver Broadcom Corporation= (Nasdaq:BRCM), the leading provider of integrated circuits enabling broadb= and communications, today introduced the Broadcom(R) BCM2033 single-chip tr= ansceiver for Bluetooth(TM) wireless applications. Integrating previously d= eveloped, Bluetooth-compliant radio and baseband components onto a single h= igh-performance integrated circuit, the chip minimizes component counts and= board space requirements while providing a high-performance solution to th= e Bluetooth short-range wireless connectivity challenges faced by equipment= manufacturers. The Blutonium(TM) BCM2033 achieves the highest performanc= e of any single-chip Bluetooth transceiver in the industry, combining Bluet= ooth-qualified radio and baseband circuits onto a single monolithic chip. O= n-board Fractional-N synthesizer technology allows the chip to work with pr= actically any reference frequency available. This is especially useful in c= urrent and third generation (3G) cellular phones in which a wide variety of= crystal oscillators are available. Featuring high levels of integration an= d minimal off-chip filters or other active components, the BCM2033 provides= excellent performance in the presence of radio interferers and is ideally = suited for harsh radio frequency (RF) environments, such as inside mobile p= hones and laptop computers. In addition, the chip's unique design allows it= to maintain its high performance even across the extended temperature rang= e of between -40 and +105 degrees centigrade, an accomplishment unparallele= d in the industry. "With our previously announced Blutonium products, we = demonstrated our unique ability to achieve outstanding radio performance de= signing chips in a standard digital CMOS process," said K.C. Murphy, Vice P= resident and General Manager of Broadcom's RF and Advanced Mixed Signal Bus= iness Unit. "We've now applied Broadcom's well-known integration expertise = by combining RF and digital circuits onto a single substrate while maintain= ing unmatched performance among Bluetooth transceivers. As a result, we're = unveiling the single-chip Bluetooth transceiver the industry has been waiti= ng for, with performance exceeding that of practically any other solution, = regardless of the process technology." The BCM2033 is based upon Broadcom= 's previous all-CMOS stand-alone radios and basebands that have already ach= ieved Bluetooth Version 1.1 qualification and which exceed the Bluetooth sp= ecification in most areas. This means that devices such as mobile phones an= d PC cards built using Blutonium components are compatible with the latest = version of the Bluetooth specification, easing the process by which these d= evices can apply the Bluetooth logo to their products. The BCM2033 benefits= from this previous development, achieving strong performance in key areas = such as linearity and receiver sensitivity, attaining a sensitivity figure = of better than -82 dBm. Integration of the previously developed circuits = onto a single chip was made possible because the entire Blutonium line, lik= e all Broadcom chip products, was developed in a standard digital CMOS (or = Complimentary Metal Oxide Semiconductor) manufacturing process. No other pr= ocess allows the combination of RF and digital circuits on a single transce= iver. "By first proving our radio and baseband architectures in CMOS with= standalone products, we've chosen to emphasize performance in our Bluetoot= h component development program," said Scott Bibaud, Director of Marketing = for Broadcom's Bluetooth Products. "With these multiple Blutonium elements = integrated onto a single cost-effective chip, we can now leverage Broadcom'= s proven reputation for operational excellence and provide these components= in production quantities to our customers around the world." Key Feature= s The BCM2033 has been designed to provide very high performance in Blueto= oth applications with a single transceiver. Notable features include: -- = Strong spurious emissions performance -- the BCM2033 minimizes interfe= rence from transmissions taking place in the bands used by mobile phone= s, providing robust connections between Bluetooth devices. -- Excepti= onal blocking performance -- the highly linear design eliminates the ne= ed for costly off-chip RF filtering to receive reliable signals from ot= her Bluetooth devices. -- Fractional-N Synthesizer -- this synthesizer en= ables the 2033 to use any existing frequency reference, including those= commonly available in mobile phones such as CDMA, WCDMA, GSM, GPRS, an= d UMTS, eliminating the need for an off-chip crystal. -- Extensive so= ftware support -- the BCM2033 is software-compatible with protocol stac= ks developed by leading third party stack vendors, as well as with Broa= dcom's internal stack. -- Cost-effective memory architecture -- on-chip m= emory eliminates the need for off-chip flash while allowing the use of = additional memory when appropriate. -- Requires minimal off-chip comp= onents -- by eliminating all external active components, the BCM2033 re= quires just a few passive components, providing very limited bill of ma= terials (BOM) and board space impact on OEM equipment designs. Avai= lability The version of the BCM2033 with no external memory bus is package= d in a 64-pin fine pitch Ball Grid Array (fpBGA) and the version with exter= nal flash interfaces is packaged in a 100-pin fpBGA. The transceiver is sam= pling now to early access customers. About Broadcom Broadcom Corporation= is the leading provider of highly integrated silicon solutions that enable= broadband communications and networking of voice, video and data services.= Using proprietary technologies and advanced design methodologies, Broadcom= designs, develops and supplies complete system-on-a-chip solutions and rel= ated applications for digital cable set-top boxes and cable modems, high-sp= eed local, metropolitan and wide area and optical networks, home networking= , Voice over Internet Protocol (VoIP), carrier access, residential broadban= d gateways, direct broadcast satellite and terrestrial digital broadcast, d= igital subscriber lines (xDSL), wireless communications, System I/O(TM) ser= ver solutions and network processing. Broadcom is headquartered in Irvine, = Calif., and may be contacted at 949/450-8700 or at www.broadcom.com. Safe= Harbor Statement under the Private Securities Litigation Reform Act of 199= 5: This release may contain forward-looking statements that are based on = our current expectations, estimates and projections about our industry, and= reflect management's beliefs and certain assumptions made by us based upon= information available to us at this time. Words such as "anticipates," "ex= pects," "intends," "plans," "believes," "seeks," "estimates," "may," "will"= and variations of these words or similar expressions are intended to ident= ify forward-looking statements. In addition, any statements that refer to e= xpectations, projections or other characterizations of future events or cir= cumstances, including any underlying assumptions, are forward-looking state= ments. These statements speak only as of the date hereof. Such information = is subject to change, and we will not necessarily inform you of such change= s. These statements are not guarantees of future performance and are subjec= t to risks, uncertainties and assumptions that are difficult to predict. Th= erefore, our actual results could differ materially and adversely from thos= e expressed in any forward-looking statements as a result of various factor= s. Important factors that may cause such a difference for Broadcom in con= nection with the Blutonium BCM2033 product includes, but are not limited to= , general economic conditions and specific conditions in the markets we add= ress, including the recent significant economic slowdown in the technology = sector and semiconductor industry; the timing and successful completion of = technology and product development through volume production; the rate at w= hich our present and future customers and end-users adopt Broadcom's techno= logies and products in the markets for Bluetooth wireless applications; del= ays in the adoption and acceptance of industry standards in those markets; = the timing of customer-industry qualification and certification of our prod= ucts and the risks of non-qualification or non-certification; the timing, r= escheduling or cancellation of significant customer orders; the loss of a k= ey customer; the volume of our product sales and pricing concessions on vol= ume sales; the qualification, availability and pricing of competing product= s and technologies and the resulting effects on sales and pricing of our pr= oducts; the effectiveness of our expense and product cost control and reduc= tion efforts; intellectual property disputes and customer indemnification c= laims and other types of litigation risk; the availability and pricing of f= oundry and assembly capacity and raw materials; fluctuations in the manufac= turing yields of our third party semiconductor foundries and other problems= or delays in the fabrication, assembly, testing or delivery of our product= s; our ability to specify, develop or acquire, complete, introduce, market = and transition to volume production new products and technologies in a time= ly manner; the effects of new and emerging technologies; the risks of produ= cing products with new suppliers and at new fabrication and assembly facili= ties; problems or delays that we may face in shifting our products to small= er geometry process technologies and in achieving higher levels of design i= ntegration; the risks and uncertainties associated with our international o= perations; our ability to retain and hire key executives, technical personn= el and other employees in the numbers, with the capabilities, and at the co= mpensation levels needed to implement our business and product plans; chang= es in our product or customer mix; the quality of our products and any reme= diation costs; the effects of natural disasters and other events beyond our= control; the level of orders received that can be shipped in a fiscal quar= ter; and other factors. Our Annual Report on Form 10-K, recent Quarterly = Report on Form 10-Q, recent Current Reports on Forms 8-K and 8-K/A, and oth= er Securities and Exchange Commission filings discuss some of the important= risk factors that may affect our business, results of operations and finan= cial condition. We undertake no obligation to revise or update publicly any= forward-looking statements for any reason. Note to Editors: Broadcom(R),= the pulse logo(R), System I/O(TM), and Blutonium(TM) are trademarks of Bro= adcom Corporation and/or its affiliates in the United States and certain ot= her countries. Bluetooth(TM) is a trademark owned by Telefonaktiebolaget LM= Ericsson AB and licensed to participants in the Bluetooth Special Interest= Group (SIG) in the United States and certain other countries. All other tr= ademarks mentioned are the property of their respective owners. CONTACT: = Broadcom Corporation Henry Rael (public relation= s), 310/938-1596 hrael@broadcom.com or = Nick Kormeluk (investor relations), 949/585-6932 = nickk@broadcom.com or Scott B= ibaud (technical and marketing), 310/524-0065 sbibaud@bro= adcom.com URL: http://www.businesswire.com Today's News On The= Net - Business Wire's full file on the Internet with Hyperlinks to your ho= me page. Copyright (C) 2001 Business Wire. All rights reserved. -0- KE= YWORD: CALIFORNIA INTERNATIONAL EUROPE INDUSTRY KEYWORD: HARDWARE = NETWORKING TELECOMMUNICATIONS = PRODUCT [IMAGE] ***IMPORTANT NOTICE AND DISCLAIMER REGARDIN= G THIS COURTESY EMAIL*** At your request, as a subscriber to our service,= this email alert is being sent to you as a courtesy and is for information= purposes only. We are a financial news re-distributor. We are not an i= nvestment advisory and do not purport to tell or suggest which companies y= ou should monitor or which securities you should purchase or sell. 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